Pictured is the 150 µm UTSHS showing its silicon die mounted on the anodized aluminum substrate. TAKE A STEP UP! Ultra Thick Step Height Standards (UTSHS) are designed to calibrate mechanical or optical surface profilers where steps of 100 µm or above are required. These standards consist of a 10 mm x 10 mm silicon die mounted on a 50 mm x 50 mm x 5 mm anodized aluminum substrate. Ultra Thick Step Height Standards Product Description The Ultra Thick Step Height Standards consist of a trench etched into a silicon die. The width of the trench is approximately 1 mm. The length of the trench is approximately 4.5 mm. The calibrated area is clearly marked with pointers. The single crystal silicon material that the standard is made of assures a very flat and smooth working surface as well as parallelism of the top and bottom surface. These standards are extremely accurate with a stated 0.05% or better uncertainty. The standard is mounted on an extremely flat, scratch resistant, anodized aluminum substrate. Ultra Thick Step Height Standards Product Specifications Nominal Step Heights: 150 µm, 200 µm, and 250 µm Silicon Die Size: 10 mm x 10 mm Substrate Size 50 mm x 50 mm x 5 mm Uncertainty 0.05% or better. Traceability Traceable through PTB Calibrated Specimens