Pictured is the 150 µm UTSHS showing its silicon die mounted on the anodized aluminum substrate.

TAKE A STEP UP! Ultra Thick Step Height Standards (UTSHS) are designed to calibrate mechanical or optical surface profilers where steps of 100 Ám or above are required. These Ultra Thick Step Height Standards consist of a 10 mm x 10 mm silicon die mounted on a 50 mm x 50 mm x 5 mm anodized aluminum substrate.

Ultra Thick Step Height Standards Product Description

The Ultra Thick Step Height Standards consist of a trench etched into a silicon die. The width of the trench is approximately 1 mm. The length of the trench is approximately 4.5 mm. The calibrated area of the Ultra Thick Step Height Standards is clearly marked with pointers. The single crystal silicon material that the standard is made of assures a very flat and smooth working surface as well as parallelism of the top and bottom surface. These standards are extremely accurate with a stated 0.05% or better uncertainty. The Ultra Thick Step Height Standard is mounted on an extremely flat, scratch resistant, anodized aluminum substrate.

Ultra Thick Step Height Standards Product Specifications

  • Nominal Step Heights:
    150 µm, 200 µm, and 250 µm
  • Silicon Die Size:
    10 mm x 10 mm
  • Substrate Size 50 mm x 50 mm x 5 mm
  • Uncertainty
    0.05% or better.
  • Traceability
    Traceable through PTB
    Calibrated Specimens

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