Model No.
Wafer Diameter
Mounting Description
Certified Feature Sizes
Part Number
Quantity
NLSM6-0.1 Recertification
150 mm (flatted)
die mounted within an 18 mm x 18 mm module
0.1 µm, 0.2 µm, 0.4 µm, 0.8 µm, 1.0 µm
1070_VLSI
NLSM6-0.1
150 mm (flatted)
die mounted within an 18 mm x 18 mm module
0.1µm, 0.2 µm, 0.4 µm, 0.8 µm, 1.0 µm
0338227-000
NLSM6-0.1XY Recertification
150 mm (flatted)
die mounted within an 18 mm x 18 mm module
0.1 µm, 0.2 µm, 0.4 µm, 0.8 µm, 1.0 µm
0358031-000
NLSM6-0.1XY
150 mm (flatted)
die mounted within an 18 mm x 18 mm module
0.1µm, 0.2 µm, 0.4 µm, 0.8 µm, 1.0 µm
0360034-000
NLSM8-0.1 Recertification
200 mm (notched)
die mounted within an 18 mm x 18 mm module
0.1 µm, 0.2 µm, 0.4 µm, 0.8 µm, 1.0 µm
1071_VLSI
NLSM8-0.1
200 mm (notched)
die mounted within an 18 mm x 18 mm module
0.1µm, 0.2 µm, 0.4 µm, 0.8 µm, 1.0 µm
1074_VLSI
NLSM8-0.1XY Recertification
200 mm (notched)
2 die mounted within an 18 mm x 18 mm module
0.1 µm, 0.2 µm, 0.4 µm, 0.8 µm, 1.0 µm
1079_VLSI
NLSM8-0.1XY
200 mm (notched)
2 die mounted within an 18 mm x 18 mm module
0.1µm, 0.2 µm, 0.4 µm, 0.8 µm, 1.0 µm
1075_VLSI
NLSM12-0.1
300 mm (notched)
die mounted within an 18 mm x 18 mm module
0.1 µm, 0.2 µm, 0.4 µm, 0.8 µm, 1.0 µm
1076_VLSI
NLSM12-0.1XY
300 mm (notched)
2 die mounted within an 18 mm x 18 mm module
0.1 µm, 0.2 µm, 0.4 µm, 0.8 µm, 1.0 µm
1077_VLSI