Pictured is a "Thin" AutoLoad Step Height Standard, etched from a 300 mm Oxide film. The certified area is located at the wafer center. TAKING CALIBRATION A STEP FORWARD. The AutoLoad Step Height Standards (ALSHS) are designed for the calibration of surface profilers and Atomic Force Microscopes (AFM) equipped with robotic wafer handling. Intuitive pattern recognition features allow tools to quickly locate the certified feature, measure and acquire step data. When efficiency and performance count, the ALSHS keeps your tool traceable, so you can focus on the measurements that matter. AutoLoad Step Height Standards (ALSHS) Product Description Specifications for Autoload Standards with Steps Smaller than 1 µm: The "Thin" standard consists of a silicon wafer with a positive step etched out of an oxide film, accommodating of any tip width. The feature is located at the center of the wafer, along with several identical pattern recognition features that can be used for automatically de-skewing wafer rotation, and locating the step height calibration area. Specifications for Autoload Standards with Steps Larger than 1 µm For "Thick" steps, the standard consists of a silicon wafer with a negative step etched into the silicon. The feature is located in the center of the wafer, along with several identical pattern recognition features that can be used for automatically de-skewing wafer rotation, and locating the step height calibration area. AutoLoad Step Height Standards (ALSHS) Product Specifications SEMI Specification Silicon Wafers 200 mm and 300 mm Available Nominal Step Heights: Thin - 8 nm, 18 nm, 44 nm, 88 nm, 180 nm, 450 nm, 940 nm Thick - 1.8 µm, 4.5 µm, 8.0 µm, 14.5 µm, 19.5 µm, 24 µm, 50 µm, 100 µm Certified Area: Thin - 10 µm and 50 µm width Thick - 1 mm width Traceability Traceable to SI Units through NIST Calibrated Specimens, NVLAP accredited