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VLSI Standards can provide custom deposition of polystyrene latex (PSL) spheres on a variety of customer substrates, including wafers, disks, flat panels, photomasks, etc. of any size from a small chip up to a 300 mm wafer (for photomasks please use the specific Reticle Contamination Standard Questionnaire). The substrates can be coated with any films, including copper, as VLSI maintains segregated deposition facilities for Cu-free front-end processing and Cu-contaminated back-end processing. With few limitations, spheres can be deposited in the range from 40 nm to 50 m. Spot deposition or blanket deposition can be done to desired densities, and with customer supplied spheres if desired. A blanket deposition consists of spheres, all of the same size, uniformly distributed on the entire surface of the wafer or substrate. A spot deposition consists of multiple sphere sizes deposited onto a substrate. Each sphere size is deposited into a spot of approximately 20 mm diameter onto the substrate.
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